Cold chain solutions typically involve excessive packaging to ensure that the desired product temperature is maintained through distribution thereby increasing the logistics related costs, which are estimated to be six times as compared to the package itself. There are numerous solutions available for shipping temperature sensitive products that include a variety of packaging materials as well as refrigerants. Though characteristics such as the R-values of package systems and the melting points and heat absorption rates of various refrigerants have been studied in the past, none of the past studies have evaluated the effect of distribution (vibration, shocks, ambient temperature, etc.) on the reliability of the cold chain packaging solutions. This research studied the temperature profiles for factors such as the different densities for a given thickness of packaging material, wall thicknesses and distribution environment hazards. The findings of this study will be decisive in designing cost efficient and practical single-use cold chain transportation solutions for temperature sensitive products.