This presentation will cover the development of a worldwide densified transport media that meets the Joint Electron Devices Engineering Council specifications has decreased environmental impact, and allowed improvement to logistics costs and enhancements to customer logistic constraints. The new form-factor thermoformed JEDEC tray achieves this impact through a telescoping side wall that enables manufacturing media handling improvements and protects at an acceptable product shipping defect level. This opportunity for environmental stewardship has been achieved by a thorough understanding of our customer requirements, as well as the contributions of cross divisional teams working together to assess and optimize equipment and media interactions.