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Broken Image ISTA Forum | TransPack & TempPack
05/13/19 - 05/16/19



ISTA's 2019 Forum brings together the packaging community through two co-located events, TransPack and TempPack.  TransPack provides a balance of valuable presentations, case studies, research and solutions from world-leading experts surrounding the optimization of packaging for transport.  TempPack focuses on technical topics related to global temperature controlled performance packaging. The TempPack Forum creates an opportunity for presenters to share their insights, challenges, case studies and research having a direct impact on the industry.  Both programs are designed to create opportunities for you to network with like-minded professionals who are facing the same challenges in all different sectors and verticals. You can expect to build new relationships and create resources with people centered on the transport packaging industry. 

Call for Speakers: If you are interested in speaking at the ISTA Forum and have an informative topic or case study for either the TransPack or TempPack program, we’d like to hear from you. Click here to submit an abstract for the ISTA Forum.
Location: Gaylord Rockies Resort & Convention Center
6700 North Gaylord Rockies Boulevard
Aurora, CO 80019


Registration is Coming Soon for this event



The Omni-Channel Packaging Strategies Conference
10/03/18 - 10/19/18

 
Why The Omni-Channel Packaging Strategies Conference? Fundamental changes are underway in the way products are marketed, packaged, and distributed.  Professionals throughout the value chain are challenged when tasked with developing solutions to meet the demands of Omni-channel distribution.  New packaging solutions must be found or created that are both economically and environmentally sustainable. Through a balance of valuable presentations from leading experts and corporations, The Omni-Channel Packaging Strategies Conference offers a solutions driven discussion around the complexity channel-proliferation introduces for stakeholders across the board.



Online Registration has closed for this event



Stability Palletised Corrugated Packaging in Modern Supply Chains Webinar
10/18/18

Thursday, October 18th 1:30-2:00pm EST

Gérard van den Boogaard
Expertise Manager Supply Chain
Smurfit Kappa Development Centre


 
The main challenges of modern supply chains are managing the volatility, adapting to the omni-channel consumer and becoming more sustainable. In any supply chain scenario palletized packaging plays a role, however, the boundary conditions are changing rapidly.  Mixed loads, stacked pallets, repacking, etc. are no longer the exception to enable producers managing the ever-increasing supply chain complexity.
 
The higher requirements on pallet handling puts more and more pressure on the stability of palletised corrugated packaging. Palletised corrugated packages should be stable in any supply chain to avoid logistic problems, health and safety hazards and product damage.
 
The traditional way to find out if the is a trial (and error) shipment or a test. With today’s potential risks and time pressure this is not sufficient anymore. Combining the results of scientific insights, intensive testing and practical experience enabled us to develop a predictive tool to assess the stability of a palletised load. The tool helps to increase the speed and risk assess the palletized load, a critical step in today's volatile supply chain.

Registration Rate: $55   ISTA Member Discounted Rate: $0
You must be registered by 11:30am (EST) on October 18th to participate.

 







ISTA 3A - Performance Testing For Single Parcel Delivery Systems Webinar
10/30/18

Tuesday, October 30th, 1:30pm-3:00pm EST

Eric Hiser
ISTA

Vice President-Technical

 

Single parcel delivery (FedEx, UPS, etc.) has long been a popular method for distributing goods globally. The emergence of e-Commerce has only served to amplify its importance and highlight the need for properly testing packaged-products prior to shipment. The Performance Testing For Single Parcel Delivery Systems training webinar will explore the importance of pre-shipment testing and walk attendees through conducting the ISTA 3A test procedure step-by-step. Other topics that will be covered include parcel carrier networks, the history behind ISTA 3A, the elements it includes, and what these elements simulate. Learn how to bring the single parcel delivery system into a controlled lab environment by signing up today!


Registration Rate: $95   ISTA Member Discounted Rate: $55
You must be registered by 11:30am (EST) on October 29th to participate.








Developing Thermal Data Analysis Standards: Algorithms for Developing Temperature Test Profiles from Ambient Lane Data Webinar
11/14/18

Wednesday, November 14th 1:30-2:00pm EST

Bernard McGarvey, Ph.D. 
Retired
Engineering Fellow at Eli Lilly and Company


Paul Harber
Principal
Modality Solutions LLC
 

Development of thermal testing profiles using data collected from various lanes is a common practice in the pharmaceutical industry. These thermal profiles are used in chamber testing of shipping containers. Currently the available standards emphasize the use of a standard test profile. This presentation argues that we now need to begin to identify standard algorithms for developing test profiles as well. This will allow shippers to develop test profiles form their own sourced data. In particular, this presentation describes the QT(min/max) method for developing thermal profiles and demonstrates how it is superior to several existing methods that are currently in use.
 
This method is a critical element in an overall risk analysis for evaluating the suitability of pre-qualified passive container solutions. Additionally, this method can be utilized to compare thermal profiles irrespective of the method used to create them. The integration of this method with thermal modeling simulations of passive container solutions is also considered.

Bernard McGarvey Biography: Education: B.E. and Ph.D. in Chemical Engineering, University College Dublin, Ireland. Activities: Focus over the last 15 years has been on the application of first principles thinking to solving problems in the pharmaceutical industry. Most recently he has applied this to cold chain transportation to improve the speed and quality of the decision making required to optimize cold chain distribution. Professional Achievements: Retired as an Engineering Fellow at Eli Lilly and Company.

Registration Rate: $55   ISTA Member Discounted Rate: $0
You must be registered by 11:30am (EST) on November 14th to participate.

 






Developing Climatic OQ Thermal Challenge Profiles Webinar
01/16/19

Wednesday, January 16th 1:30-2:00pm EST

Bryan Cardis
Consultant Cold Chain and Packaging Engineer
Eli Lilly and Company


Jeffrey Chida 

Consultant Engineer
Eli Lilly and Company
 

There are times when products will be distributed in areas, geographic zones that might not have actual collected shipping lane ambient temperature data in order to generate thermal OQ profiles in order to qualify temperature controlled shipping containers.   Lilly has developed a process to utilize climatic data to support these undefined regions in order to develop a thermal OQ profile in the absence of actual lane data to support commercialization of the product supply chain.

Jeffrey Chida Biography: Education: BS Packaging (Michigan State University…Go Green!) Work History: 19 years at Eli Lilly and Company as packaging engineer.

Registration Rate: $55   ISTA Member Discounted Rate: $0
You must be registered by 11:30am (EST) on January 16th to participate.

 






2019 European Packaging Symposium
03/05/19 - 03/07/19



ISTA and ITENE are pleased to announce the 7th ISTA European Packaging Symposium to be held on 5-7 March 2019 in Amsterdam, Netherlands.
 
CALL FOR SPEAKERS: The 2019 Edition will explore “Industry 4.0: Packaging Innovation and Impacts in a Transforming World”.  If you are interested in submitting an informative topic or case study and would like to be a speaker at ISTA's European Packaging Symposium, we want to hear from you! CLICK HERE to submit your title and abstract.


 


Registration is Coming Soon for this event