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Developing Climatic OQ Thermal Challenge Profiles Webinar
01/16/19

Wednesday, January 16th 1:30-2:00pm EST

Bryan Cardis
Consultant Cold Chain and Packaging Engineer
Eli Lilly and Company


Jeffrey Chida 

Consultant Engineer
Eli Lilly and Company
 

There are times when products will be distributed in areas, geographic zones that might not have actual collected shipping lane ambient temperature data in order to generate thermal OQ profiles in order to qualify temperature controlled shipping containers.   Lilly has developed a process to utilize climatic data to support these undefined regions in order to develop a thermal OQ profile in the absence of actual lane data to support commercialization of the product supply chain.

Jeffrey Chida Biography: Education: BS Packaging (Michigan State University…Go Green!) Work History: 19 years at Eli Lilly and Company as packaging engineer.

Registration Rate: $55   ISTA Member Discounted Rate: $0
You must be registered by 11:30am (EST) on January 16th to participate.

 






2019 European Packaging Symposium
03/05/19 - 03/07/19



ISTA and ITENE are pleased to announce the 7th ISTA European Packaging Symposium to be held on 5-7 March 2019 in Amsterdam, Netherlands.






ISTA Forum | TransPack & TempPack
05/13/19 - 05/16/19



ISTA's 2019 Forum brings together the packaging community through two co-located events, TransPack and TempPack.  TransPack provides a balance of valuable presentations, case studies, research and solutions from world-leading experts surrounding the optimization of packaging for transport.  TempPack focuses on technical topics related to global temperature controlled performance packaging. The TempPack Forum creates an opportunity for presenters to share their insights, challenges, case studies and research having a direct impact on the industry.  Both programs are designed to create opportunities for you to network with like-minded professionals who are facing the same challenges in all different sectors and verticals. You can expect to build new relationships and create resources with people centered on the transport packaging industry. 

Call for Speakers: If you are interested in speaking at the ISTA Forum and have an informative topic or case study for either the TransPack or TempPack program, we’d like to hear from you. Click here to submit an abstract for the ISTA Forum.
Location: Gaylord Rockies Resort & Convention Center
6700 North Gaylord Rockies Boulevard
Aurora, CO 80019






2019 Forum Exhibitor Registration
05/15/19 - 05/15/19


Location: Gaylord Rockies Resort and Convention Center
6700 North Gaylord Rockies Boulevard
Aurora, CO 80019

Registration ends on May 10, 2019





2019 China Packaging Symposium
09/18/19 - 09/19/19



The 2019 ISTA China Packaging Symposium will be held on September 18-20, 2019 in Shenzhen City, Guangdong Province. The Symposium is hosted by International Safe Transit Association & ISTA China Division. It is presented by China Packaging Research & Test Center and China Packaging Research Institute.


Registration is Coming Soon for this event



2019 Asia Pacific Packaging Symposium
10/23/19 - 10/24/19



We are pleased to announce that the forth ISTA Asia Pacific Packaging Symposium will be held in the Philippines in October 2019.

More details to come.


Registration is Coming Soon for this event