The 2021 Virtual ISTA Forum, including TransPack and TempPack will be held on Tuesday, March 30th and Wednesday, March 31st.
It is more important than ever for our packaging community to come together and stay connected, to share experiences and best practices and explore opportunities. The Forum program will offer a blend of presentations, thought-provoking group discussions and even some fun and interactive networking to make the most of the virtual experience. The focused group discussions will offer attendees an opportunity to participate in an extended conversation around a shared theme or topic while discussion leaders introduce and facilitate the topics.

The following registration rates include participation in both TransPack and TempPack programs:
ISTA Member Discounted Rate: $295
Non-Member Rate: $495