This event has completed.

3/4/2020

Jay Singh
Professor & Packaging Program Director
Cal Poly State University, San Luis Obispo



While it leads the global retail opportunity index as the greatest under-served market in the world, the Indian logistics/supply chain sector has yet to even meet the requirements of the urban population due to challenges such as poor infrastructure, highly fragmented supplier base, complex systems of taxes & government regulations, ineffective usage of information technologies & communication, insufficient mature distribution channels, non-existent warehouse standards, and disorganized trucking operations. The general intended supply chains in India are fairly unique. This presentation provides summary details of the supply chain related distribution activities of 13 CPG manufacturers, retailers and e-commerce companies in India. While quite a few of the companies included in this study follow adapted versions of western supply chain models, a majority rely on fairly unique versions of the Indian legacy models.

Takeaways: At present, the Indian logistics industry is highly fragmented and unorganized. Development of logistics related infrastructure, like dedicated freight corridors, logistics parks, free trade warehousing zones and container freight stations, are expected to improve efficiencies. Players in the Indian CPG retail sector must understand the evolving logistical landscape to take advantage of greatest under-served markets in the world.

Biography: BS: Electrical Engineering (University of Pune, India), MS & PhD: Packaging Science (Michigan State University, USA).  Jay currently serves as the President of the International Association of Packaging Research Institutes (IAPRI). He has served on the Global Board of Directors for ISTA and as the Division 1 Chair of Committee D10.18 of ASTM. Jay has published over 90 peer-reviewed articles, 70 articles in conference proceedings, 30 trade journal articles, 4 book chapters, coauthored 2 books and is an inventor on 4 patents.  A number of Jay's publications have resulted in development/revision of numerous globally acknowledged packaging test standards such as ASTM and ISTA. In a span of 25 years, Jay has consulted with over 150 companies on various packaging related research projects in the automotive, pharmaceutical, medical, food, beverage, furniture, appliances and several other product categories.   Having successfully undertaken numerous funded grants from state, federal agencies and industry, Jay was recognized with the Distinguished Scholarship Award in 2017 by Cal Poly.

Registration Rate: $55   ISTA Member Discounted Rate: $0
You must be registered by 11:30am (EST) on March 4th to participate.