FEA (numeric) modeling and analysis tools are steadily being integrated into common CAD and Design suites, many of which are already in use in many operations and some available at little or no cost to small businesses and educators. This trend, combined with the plummeting cost of small, accurate bolometric infrared imaging devices for broad-field non-contact temperature measurement, provides the possibility of cost-effective, proactive thermal simulation modeling and verification with modest cost and minimal training, particularly for those already conversant with CAD design tools. This combination provides the promise of innovative and efficient use of space and materials, efficient implementation of non-standard geometries, and development of other design refinements that may provide cost savings and efficiency improvements, as well as greater safety factors for the product.