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SOLUTIONS to COMBAT E-COMMERCE and OMNI-CHANNEL DISTRIBUTION CHALLENGES

Committed to doing everything we can to help keep our communities to stay safe and connected during this evolving time, we are presenting the third annual 2020 Omni-Channel Packaging Strategies Conference as a Webinar Series! We fully intend to hold the 2021 conference at a future location where everyone can network and share in person, but only when the timing is right.

Driven by e-commerce, retail continues to change, and sales channels and traditional packaging continue to blur. The way product is sold and delivered to consumers is evolving at a rapid pace.  New packaging solutions must be discovered or created for today's unified retail market that are both economically and environmentally sustainable.  If packaged-product designs don't evolve, damage and waste in distribution will continue to grow.  This webinar series is for stakeholders across the distribution chain to learn about solutions needed to combat the challenges created by e-commerce and omni-channel distribution.

If you are interested in being a webinar series speaker and have an informative topic or case study, we want to hear from you! Please submit your proposal if you have interesting content related to:

  • Omni-channel case studies (new design, redesign, root cause analysis)
  • Innovations in retail automation and technology impacting packaging
  • Packaging innovations for omni-channel retail
  • Supply chain evolution and innovation
  • Marketing strategies impacting packaging for omni-channel

 







We are pleased to present
the 2021 ISTA Forum | TransPack & TempPack, to be held March 29 - April 1, 2021 at the Marriott Marquis San Diego Marina in San Diego, California.  

Speaking at ISTA's TransPack or TempPack events provides numerous benefits for you, your projects and your company including exposure and credibility as an industry forerunner. TransPack provides a balance of valuable presentations, case studies, research and solutions from world-leading experts surrounding the optimization of packaging for transport. TempPack focuses on technical topics related to global temperature controlled performance packaging and creates an opportunity for presenters to share their insights, challenges, case studies and research having a direct impact on the industry.

ISTA is interested in topics related to but not necessarily limited to the following for our programs:

  • Packaging Performance Testing Applications and Research
  • Challenges of Protective Package Design
  • Quality Assurance and Validation Best Practices
  • Damage Reduction Success Stories
  • e-Commerce Packaging
  • Sustainable Packaging Development
  • Optimization of Packaging Systems Case Studies

  • Case Studies on gathering temperature lane data
  • New Methods for Protecting High Value Product in the Supply Chain
  • Unique Algorithms that Simplify Supply Chain Decision Making
  • Unique Design and Distribution Challenges Posed from Large Molecule Protein Solutions
  • Use of the Internet of Things (IoT) for Gathering or Acting on Temperature Data Within a Supply Chain.
  • Simulation Applications as a Tool for Reducing Laboratory Studies
  • Innovative Cold Chain Packaging Solutions






We are pleased to announce that the 2021 ISTA European Packaging Symposium will be held 2-4 March 2021 in Berlin, Germany at the Courtyard by Marriott Berlin City Center.

If you are interested in speaking at the Symposium and have an informative topic or case study, we want to hear from you! Please submit your proposal if you have interesting content related to:

  • Trends Retail, Logistics, Packaging
  • Cold-Chain
  • Packaging Performance Testing Applications and Research
  • Challenges of Protective Package Design
  • Quality Assurance and Validation Best Practices
  • Damage Reduction Success Stories
  • e-Commerce Packaging
  • Sustainable Packaging Development
  • Optimization of Packaging Systems Case Studies
  • Digital Simulation