International Safe Transit Association

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ISTA's 2019 Forum brings together the packaging community through two co-located events, TransPack and TempPack.

TransPack provides a balance of valuable presentations, case studies, research and solutions from world-leading experts surrounding the optimization of packaging for transport.

TempPack focuses on technical topics related to global temperature controlled performance packaging. The TempPack Forum creates an opportunity for presenters to share their insights, challenges, case studies and research having a direct impact on the industry.

Both programs are designed to create opportunities for you to network with like-minded professionals who are facing the same challenges in all different sectors and verticals. You can expect to build new relationships and create resources with people centered on the transport packaging industry.

ISTA is interested in topics related to but not necessarily limited to the following for our programs:

TransPack Forum:
- Packaging Performance Testing Applications and Research
- Challenges of Protective Package Design
- Quality Assurance and Validation Best Practices
- Damage Reduction Success Stories
- e-Commerce Packaging
- Sustainable Packaging Development
- Optimization of Packaging Systems Case Studies
- Innovative Cold Chain Packaging Solutions

TempPack Forum:
- Case Studies on gathering Lane Data (temperature, shock, vibration)
- New Methods for Protecting High Value Product in the Supply Chain
- Unique Algorithms that Simplify Supply Chain Decision Making
- Unique Design and Distribution Challenges Posed from Large Molecule Protein Solutions
- Use of the Internet of Things (IoT) for gathering or acting on temperature data within a supply chain.
- Simulation Applications as a Tool for Reducing Laboratory Studies

The submission deadline is October 31, 2018.


Submissions accepted from 12:00 EST on 09/02/2017 to 11:59pm EST on 10/31/2018